PI's Fast Multi-Channel Photonics Alignment (FMPA) solutions combine application-optimized, fab-ready, highly dynamic alignment stages with sophisticated controllers that integrate the world's most advanced and effective first-light search, profile, and power optimization alignment algorithms.
This award-winning technology addresses the number one cost driver for photonics test and assembly: the precise alignment required for each element and channel. Legacy alignment technologies date back to the 1980s and can take minutes to complete. PI's fast optical alignment solutions reduce the time required by typically 99 %, routinely completing the task in less than one second. With studies indicating that on the order of 80 % of the cost of a photonic device is consumed in the alignment prior to FMPA, it is easy to see how profound the production economics benefit from reducing that 80 % by 99 %. And with projections of three orders of magnitude escalation in demand for photonic components in the near future, as new applications and devices emerge, FMPA is a true enabler.
These integrated solutions combine PI's premier compact hexapod with a highly dynamic, ultra-resolution NanoCube® fast piezo scanning stage to provide 6-DoF positioning, scanning, and optimization. Since their introduction in 2016, these unique microrobotic solutions have enabled a variety of applications ranging from silicon photonics wafer probing to array alignment and automated photonics device assembly and are the first choice of many elite OEMs and in-house integration teams. The applications are complex, but the reasons for the choice are simple: groundbreaking alignment speed that improves production throughput by two orders of magnitude, an easy-to-master command set complemented by broad and deep software support, and global application expertise and support.
The combined hexapod and NanoCube® mechanisms operate synergistically to enable simultaneous optimization across multiple channels, I/Os, and DoF, with parallel optimization across all DoF and I/Os. For example, the NanoCube® offers extreme speed and long life through flexure guides and PICMA piezo drives, while the hexapod offers generous travel that includes pitch-yaw-roll positioning and alignment optimization important for arrayed waveguides, etc. High-resolution analog inputs provide connectivity to power measurement devices, such as PI’s F-712.PM1 high-bandwidth optical power meter, for optimization and profiling, enabling efficient and fast automated fiber optical alignment. Soft limits are supported to ensure process safety.
PI’s 6-DOF fiber alignment systems include the F-712.HA1, F-712.HA2, and F-712.HU1 standard configurations.
The F-712.HA1 and F-712.HA2 single-sided and double-sided angled configurations offer a low profile. This means that the alignment can be performed close to (or even under) the mounting surface thanks to the hexapod’s angled mounting. Ideal for silicon photonics wafer probing applications.
The F-712.HU1 single-sided upright configuration is ideal for device characterization and packaging processes. Upright configurations for two or even more sides are available on request.
Starting with these sophisticated platforms, it is easy to configure further alignment solutions of unprecedented speed that support functionalities such as submicron-sensitive wafer proximity automation.
PIC production, alignment of fiber arrays, collimators, optical components or lenses, silicon photonics wafer probing, testing, assembly, and packaging of photonics and fiber optics
Motion and positioning | F-712.HA1 | F-712.HA2 | F-712.HU1 | Unit |
|---|---|---|---|---|
Number of active axes | 9 | 18 | 9 | |
Rough positioning | ||||
Active axes | X, Y, Z, θX, θY, θZ | |||
Travel range in X, Y, Z | ±6,5, ±16, ±8,5 | ±17, ±16, ±6,5 | mm | |
Travel range in θX, θY, θZ | ±14,5, ±10, ±10 | ±10, ±10, ±21 | ° | |
Minimum incremental motion in X, Y | 0.1 | µm | ||
Minimum incremental motion in Z | 0.1 | 0.05 | ||
Max. velocity | 10 | mm/s | ||
Sensor type | Incremental rotary encoder | |||
Drive type | Brushless DC motor | |||
Fine positioning | ||||
Active axes | X, Y, Z | |||
Travel range in X, Y, Z, closed loop | 100 | µm | ||
Min. incremental motion, open-loop | 0.3 | nm | ||
Min. incremental motion, closed-loop | 2.5 | nm | ||
Linearity error, for the entire travel range* | 2 | % | ||
Repeatability (bidirectional) 10% travel range | 2 | nm | ||
Sensor type | Incremental linear encoder | |||
Drive type | PICMA® | |||
Alignment | ||||
Scanning time of spiraled area scan 500 µm Ø** | < 2 | < 5 | < 2 | s |
Scanning time of spiraled area scan 100 µm Ø** | < 0.3 | < 1 | < 0.3 | s |
Scanning time of spiraled area scan 10 µm Ø** | < 0.2 | < 0.5 | < 0.2 | s |
Signal optimization with gradient search, randomized with ±5 µm (repeatability < 0.01 dB)*** | < 0.3 | s | ||
F-712.HP1 Mounting Adapter for F-712.HA1 / F-712.HA2 Fiber Alignment Systems
用于P-616类型(NanoCube)压电定位器的F-603.41 / F-603.42 / F-603.43纤维支架
用于快速多通道光子学对准的六自由度F-712.HA1和F-712.HA2系统。硬件描述。
快速多通道光子学对准。用于硅光子学生产中的快速光学对准的硬件和固件。
光功率的计算 - 使用F-712.PM1功率计和F-712高精度光纤对准系统
F-712.HU1 High-Precision Fiber Alignment System
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在众多领域中，兴起了将器件对准至纳米级精度的需求。诸如小型照相机中的镜头或镜头组件等光学部件乃至CCD芯片自身，均需要以更高的精度进行定位。
PI提供高精度驱动器，其可用作EtherCAT从控制器，或与ACS运动控制器集成后用作主控制器，或在现有结构中用作第二主控制器。
数字技术为提高不存在于传统模拟技术的控制工程的性能开辟了可能性。
高速USB或TCP/IP接口以及RS-232是PI现代数字控制器支持的标准接口。此外，PI也提供数字或模拟实时能力接口。
六足位移台平台适用于在所有六个自由度（即三根线性轴和三根旋转轴）实现负载的准确定位和校准。
